Capabilities
| CURRENT CAPABILITY |
|---|
| Implanter (B, Al, N, P - 900 keV Max) |
| SiC Epitaxial Growth (Currently, n-type only) |
| Activation (1900°C Max Process Temperature) |
| Oxidation (1500°C Max Process Temperature) |
| i-Line Stepper - 0.5 μm |
| Coater/Developer/Bake |
| Wet Process Cleaning |
| PECVD (SiO2, SiN, Oxynitride) |
| LPCVD Polysilicon Deposition |
| P-Doping for Polysilicon |
| LPCVD SiO2 and BPSG Deposition |
| Anneal Furnace (1200°C Max Process Temperature) |
| Plasma Etch - SiO2 |
| Plasma Etch - Si and Limited SiC |
| Ashers |
| Ellipsometry |
| CD Vertification |
Capability to be Installed Through 2026
| CAPABILITY TO BE INSTALLED THROUGH 2026 |
|---|
| Wet Process Semi-Automated Benches |
| Mask Aligner |
| Epi Defect Scanning |
| Rapid Thermal Annealing |
| ICP-MS |
| Plasma Metal Etch |
| Automated CV Measurement - Temperature Dependent |
| Automated Probe Stations |
| 4-Point Probe |
| Multi-Chamber PVD Sputter (Metal Deposition) |
| Multi-Chamber Metal Deposition (Sputter - 2nd Tool) |
| ICP Etcher - Multi-chamber RIE (Hardmask and SiC) |
Capabilities Under Review
| CAPABILITIES UNDER REVIEW |
|---|
| SiC Backgrinding |
| Laser Annealing |
| Contactless CV |
Staff
Workforce Development Director
Shawn Bell
Facilities Manager
Nestor Camargo
Workforce Development Research Associate
Rachel Chapko
Faculty Director
Zhong Chen
Facility Senior Process Engineer
Zach Cole
Workforce Development Lead
Jeff Dix
Executive Director
H. Alan Mantooth
Facility Equipment Engineer
Joe Mendiola
Facility Process Engineer
Tanner Rice
Technical Director
Greg Salamo
Chief Technology Officer
Thomas White
Contact